New Releases

Nationstar High-Reliability Side View LED Chip

Side-View Chip

Side-View Chip

With the commercial deployment of 5G technology, accelerated digital transformation, and deepening development of Industry 4.0, the communications equipment market is experiencing robust growth momentum. Nationstar introduces its “High-Reliability Side View LED Series”, suitable for use as indicator LEDs in wireless APs, switches, routers, and other communications equipment. This series meets the demands for precision and slimline design in devices, propelling the communications equipment industry toward high-end, intelligent, and eco-friendly advancements.

Side View LED Compact Dimensions

Precision-manufactured on BT-material PCB boards, the device measures 1.8mm × 0.3mm × 1.0mm. It integrates seamlessly into flexible circuit boards, enabling compact design upgrades for equipment.

Precision Packaging

Passing nine extreme environment tests including 1000 hours of high-temperature/high-humidity (dual 85 test) and 500 thermal shock cycles, it achieves an MTBF (Mean Time Between Failures) exceeding 100,000 hours, ensuring stable operation under harsh conditions.

Quality Assurance

Production processes leverage automated, efficient workflows with end-to-end digital integration across the entire supply chain. This enables product traceability and controlled overall costs, delivering cost-effective solutions for mass production of miniaturized products.

As a pioneer in CHIP LED manufacturing in mainland China, Nationstar has established a comprehensive CHIP LED product portfolio, featuring two core series: front-emitting and side-emitting LEDs. These series deliver outstanding performance and strong adaptability, meeting diverse market application demands. The company has successfully entered the supply chains of internationally renowned telecommunications enterprises, with its leading technology and consistent quality earning widespread customer recognition.

Related Posts

Leave a Reply

Your email address will not be published. Required fields are marked *